This video describes the development of a dual channel PA (Power Amplifier) housed in a custom laminate SMT package that covers the full 26 GHz 5G band. The PA MMIC was designed by Plextek RFI, and offers a gain of 22dB with an RF output power of 26dBm at P-1dB and a PAE of around 30%. The laminate-packaged dual-channel component was developed in collaboration with Filtronic, with support from the UK’s Compound Semiconductor Applications Catapult (CSA Catapult). Excellent RF performance of the package transition, from die to PCB, is demonstrated.